Data center modular systems

ABSTRACT

A modular data center system includes an upper module including a roller assembly attached to a frame of the upper module, the roller assembly configured to engage at least a portion of a rail assembly attached to a structure of a data center building; and a lower module attachable to the upper module and configured to suspend above a floor of a human-occupiable workspace of the data center that supports a plurality of racks including a plurality of heat-generating electronic devices, the lower module including a power support assembly configured to provide electrical power to the plurality of heat-generating electronic devices.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of, and claims priority under 35U.S.C. § 120 to, to U.S. patent application Ser. No. 15/653,973, filedon Jul. 19, 2017, and entitled “Data Center Modular Systems,” which inturn claims priority to U.S. Provisional Patent Application Ser. No.62/364,161, filed on Jul. 19, 2016, and entitled “Cooling a DataCenter.” The entire contents of both previous applications areincorporated by reference herein.

TECHNICAL FIELD

The present disclosure relates to systems and methods for cooling datacenter systems and computing components.

BACKGROUND

Data centers house various computing systems and components such ascomputer processors, storage systems or drives, servers, and othercomputing components. A data center may take up a room in a building, anentire building itself and may be stationary in form or may be portable,for example housed in a shipping container. A data center, whetherstationary or portable, may also be modular. The computer relatedcomponents housed in a data center consume significant amounts ofelectrical power and thereby produce significant amounts of heat duringcomputing and storage operations. If the computer related componentsexceed certain temperatures, the performance of the components can becompromised and/or the components may fail. Accordingly, cooling systemsare generally implemented to maintain proper and efficient functioningof the computer related components housed in a data center as thecomponents operate to transfer, process, and store data. The coolingsystems may include components configured to move fluids such as air orliquid through various configurations and based on varying conditions.

SUMMARY

In a general implementation, a modular data center system includes anupper module including a roller assembly attached to a frame of theupper module, the roller assembly configured to engage at least aportion of a rail assembly attached to a structure of a data centerbuilding; and a lower module attachable to the upper module andconfigured to suspend above a floor of a human-occupiable workspace ofthe data center that supports a plurality of racks including a pluralityof heat-generating electronic devices, the lower module including apower support assembly configured to provide electrical power to theplurality of heat-generating electronic devices.

In an aspect combinable with the general implementation, the uppermodule further includes an air conditioning module.

In another aspect combinable with any of the previous aspects, the lowermodule includes at least one side that extends vertically from a ceilingthat is attached to the frame of the upper module, the ceiling includingan aperture to permit airflow from the air conditioning module to avolume defined by the side and the ceiling.

In another aspect combinable with any of the previous aspects, thevolume includes a portion of a conditioned air plenum that extends fromthe ceiling of the lower module to a top of the plurality of racks, theconditioned air plenum further defined between back sides of rows of theplurality of racks.

In another aspect combinable with any of the previous aspects, the airconditioning module includes a conditioning module positioned over theaperture in the ceiling of the lower module; and a fan positioned tocirculate a conditioned airflow from the conditioning module, throughthe portion of the conditioned air plenum, through the back sides of therows of the plurality of racks, through front sides of the rows of theplurality of racks to the human-occupiable workspace, and to theconditioning module.

In another aspect combinable with any of the previous aspects, theconditioning module includes at least one of a cooling coil, a heatingcoil, an energy recovery ventilator, or a constant or variable airvolume box.

In another aspect combinable with any of the previous aspects, the lowermodule further includes a seal to receive a portion of the plurality ofracks and seal against an airflow between the human-occupiable workspaceand the portion of conditioned air plenum.

In another aspect combinable with any of the previous aspects, theroller assembly includes a plurality of wheels or sliders that engagethe rail assembly.

In another aspect combinable with any of the previous aspects, thestructure of the data center building includes a column that extendsbetween the floor and a roof of the data center building.

Another aspect combinable with any of the previous aspects furtherincludes an accessory module coupled to the upper module.

In another aspect combinable with any of the previous aspects, theaccessory module includes a pipe rack.

In another general implementation, a data center system includes anupper module including an air conditioning module; a lower moduleattached to the upper module and configured to suspend above a floor ofa human-occupiable workspace of a data center building that supports aplurality of racks including a plurality of heat-generating electronicdevices, the lower module including a power support assembly configuredto provide electrical power to the plurality of heat-generatingelectronic devices; a roller or slider assembly attached to a frame ofthe upper module, the roller assembly including at least one roller orslider; and a rail assembly attachable to a structure of the data centerbuilding, the rail assembly including a beam engageable by the roller orslider.

In an aspect combinable with the general implementation, the lowermodule includes at least one side that extends vertically from a ceilingthat is attached to the frame of the upper module, the ceiling includingan aperture to permit airflow between the upper module and a volumedefined by the side and the ceiling of the lower module.

In another aspect combinable with any of the previous aspects, thevolume includes a portion of a conditioned air plenum that extends fromthe ceiling of the lower module to a top of the plurality of racks, theconditioned air plenum further defined between back sides of rows of theplurality of racks.

In another aspect combinable with any of the previous aspects, the airconditioning module is positioned over the aperture in the ceiling ofthe lower module and includes a conditioning module and a fan, the fanpositioned over the aperture to circulate a conditioned airflow from theconditioning module, through the portion of the conditioned air plenum,through the back sides of the rows of the plurality of racks, throughfront sides of the rows of the plurality of racks to thehuman-occupiable workspace, and back to the conditioning module.

In another aspect combinable with any of the previous aspects, theconditioning module includes at least one of a cooling coil, a heatingcoil, an energy recovery ventilator, or a constant or variable airvolume box.

In another aspect combinable with any of the previous aspects, the lowermodule further includes a seal to receive a portion of the plurality ofracks and seal against an airflow between the human-occupiable workspaceand the portion of the conditioned air plenum.

In another aspect combinable with any of the previous aspects, thestructure of the data center building includes a column that extendsbetween the floor and a roof of the data center building.

In another aspect combinable with any of the previous aspects, the beamextends between at least two columns of the data center building.

Another aspect combinable with any of the previous aspects furtherincludes an accessory module coupled to the upper module.

In another aspect combinable with any of the previous aspects, theaccessory module includes a pipe rack.

In another aspect combinable with any of the previous aspects, theaccessory module further includes a plurality of fire protectionelectrical assemblies that include wiring and electrical connectors fora fire protection system.

In another aspect combinable with any of the previous aspects, theaccessory module further includes at least a portion of a fireprotection system piping system that includes a plurality of sprinklerheads of the fire protection system.

In another aspect combinable with any of the previous aspects, theaccessory module further includes a plurality of data center lightingfixtures or data center lighting wiring assemblies.

Another aspect combinable with any of the previous aspects furtherincludes a support structure that includes at least a portion of theceiling to thermally separate cold air aisle of the conditioned plenumfrom a warm air aisle.

In another general implementation, a method of conditioning a datacenter includes installing a first module of a data center coolingsystem on a rail assembly attached to a data center building, the firstmodule including a frame and an air conditioning module; attaching asecond module of the data center cooling system to the first module, thesecond module including a panel attached to the frame of the firstmodule and sides that extend from the panel to suspend over a floor ofthe data center building; and moving the first and second modules of thedata center cooling system adjacent to at least one row of a pluralityof data center racks that support a plurality of heat-generatingelectronic devices by moving the first module on the rail system througha human-occupiable aisle of a workspace of the data center buildingdefined between rows of columns of the data center building.

An aspect combinable with the general implementation further includescirculating a cooling fluid through a supply conduit, to the coolingmodule, that is supported by a third module of the data center coolingsystem attached to the first module.

Another aspect combinable with any of the previous aspects furtherincludes circulating, with a fan of the cooling module, an airflow froma cooling coil of the cooling module through an opening in the panel andinto a cold air plenum defined by the panel and the sides of the secondmodule.

Another aspect combinable with any of the previous aspects furtherincludes circulating the airflow through the plurality of data centerracks; receiving, into the airflow, heat from the plurality ofheat-generating electronic devices; and circulating the heated airflowthrough the workspace of the data center building and to the coolingcoil.

In another aspect combinable with any of the previous aspects, the datacenter cooling system includes a first data center cooling system.

Another aspect combinable with any of the previous aspects furtherincludes installing at least another row of a plurality of data centerracks that support a plurality of heat-generating electronic devicesinto the data center building; based on the installation of the at leastinstalling a first module of a second data center cooling system on therail assembly attached to the data center building, the first module ofthe second data center cooling system including a frame and a coolingmodule; attaching a second module of the second data center coolingsystem to the first module of the second data center cooling system, thesecond module of the second data center cooling system including a panelattached to the frame of the first module of the second data centercooling system and sides that extend from the panel to suspend over thefloor of the data center building; and moving the first and secondmodules of the second data center cooling system adjacent to the anotherrow of the plurality of data center racks by moving the first module ofthe second data center cooling system on the rail system through thehuman-occupiable aisle of the workspace of the data center buildingdefined between rows of columns of the data center building.

Another aspect combinable with any of the previous aspects furtherincludes fluidly connecting the cooling modules of the first modules ofthe first and second data center cooling systems to a source of coolingfluid.

Another aspect combinable with any of the previous aspects furtherincludes electrically coupling the plurality of heat-generatingelectronic devices to a main power supply through electrical conduitssupported on the second module.

In another aspect combinable with any of the previous aspects, the datacenter cooling system includes a first data center cooling system.

Another aspect combinable with any of the previous aspects furtherincludes adjusting a power density of at least a portion of theplurality of heat-generating electronic devices; based on the adjustmentof the power density: installing a first module of a second data centercooling system on the rail assembly attached to the data centerbuilding, the first module of the second data center cooling systemincluding a frame and a cooling module; attaching a second module of thesecond data center cooling system to the first module of the second datacenter cooling system, the second module of the second data centercooling system including a panel attached to the frame of the firstmodule of the second data center cooling system and sides that extendfrom the panel to suspend over the floor of the data center building;and moving the first and second modules of the second data centercooling system adjacent to the row of the plurality of data center racksby moving the first module of the second data center cooling system onthe rail system through the human-occupiable aisle of the workspace ofthe data center building defined between rows of columns of the datacenter building; and operating the first and second data center coolingsystems to cool the plurality of heat-generating electronic devices.

Implementations according to the present disclosure may include one ormore of the following features. For example, implementations of a datacenter system according to the present disclosure may be modular andscalable to account for different sized (e.g., total power) datacenters. For example, the data center cooling system can be scalablebetween, e.g., 500 kW data centers (e.g., IT power) and 500 MW datacenters. As another example, the scalable data center cooling system canbe included of modular, factory-assembled components to reduce aconstruction schedule of the data center. Further, the data centercooling system may have significant deployment efficiency, allowing forchangeable quantities and dimensions of, e.g., rows of electronic deviceracks, changeable power densities, and otherwise. As yet a furtherexample, the data center cooling system may have significant power andcooling efficiency, such that units of IT power (e.g., racks of servers)may be installed to share cooling and allow for over-subscription ofpower infrastructure (e.g., maximum power available less than maximumrated IT power).

As yet another example, the data center system may allow for moreefficient costs of small-scale data centers by utilizing similar modulesthat are used to build large data centers, by taking advantage of theeconomies of scale and reduction in costly, specialized equipmentdesigned for small-scale data centers. As another example,modularization of an entire server floor to include all aspects ofrequired interfaces and products may minimize construction, costs, timeand improve quality, thereby gaining repeatability and consistency fromany project site. Further, modules of the data center may be builtoff-site from the data center building, itself, allowing for parallelconstruction schedules to save deployment time. As another example,existing data centers may be retrofitted (e.g., with a rail or othersupport assembly) to allow the modularization of existing,conventionally-deployed data centers. As yet another example,construction of data centers may be made safer compared to conventiontechniques when fabrication of part or all of some key data centersystems (e.g., the cooling system) is performed offsite. Further,fabrication of such data center cooling systems may be performed at alocation which has necessary skilled labor, even if such a location isdifferent than a data center location. Thus, there may be a reduceddependency on local (e.g., local to the data center location) laboravailability, thereby reducing construction risks and producingconstruction timelines with more predictable schedules. Other advantagesof moving construction offsite are: because the offsite-fabricatedsystems can be completed in a controlled, weather-protected environmentby groups of the same workers, it is possible to improve system qualityand consistency and optimize fabrication techniques. The schedule canalso be reduced by moving key systems off the critical path. As yetanother example, the data center modular system may provide foreffectively limitless bidirectional scalability, aided by the symmetryof the interfaces of the system, e.g., with the vertical attachmentpoints on each of the faces of a lower module of the system.

The details of one or more implementations of the subject matterdescribed in this disclosure are set forth in the accompanying drawingsand the description below. Other features, aspects, and advantages ofthe subject matter will become apparent from the description, thedrawings, and the claims.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A-1C are end, side, and top views, respectively, of a schematicillustration of a scalable data center cooling system according to thepresent disclosure.

FIG. 2 is an isometric view of a schematic illustration of a data centersystem comprised of multiple scalable data center cooling systemsaccording to the present disclosure.

FIGS. 3A-3C are flowcharts depicting example methods of arranging ascalable data center cooling system and cooling a data center accordingto the present disclosure.

FIG. 4 is a schematic illustration of an example controller for a datacenter cooling system according to the present disclosure.

DETAILED DESCRIPTION

FIGS. 1A-1C are end, side, and top views, respectively, of a schematicillustration of a scalable data center cooling system 100. Generally,the data center cooling system 100 includes one or more-lower modules130 and one or more upper modules 118 that operate to coolheat-generating electronic devices (e.g., servers, processors, networkdevices, or other electronic devices) supported in rows of racks 112. Inthis example, heat-generating devices 148 are shown in a tray on therack 112 in FIG. 1B. The racks 112 may support multiple trays, which maybe mounted vertically or horizontally, and may include one or moremotherboards or daughterboards to support the heat-generating devices148.

The heat-generating electronic 148 devices in the racks 112 may beimplemented for processing, transmitting and/or storing data. Theheat-generating electronic devices 148 may include other computingdevices or components related to the operation of the servers. Theheat-generating computing devices 148 generate heat as the devicesoperate to process, transmit, and store data locally and with remotecomputing systems. In the case of servers, for example, the devices 148may, for example be connected to a local or remote network and mayreceive and respond to various requests from the network to retrieve,process, and/or store data. The servers may facilitate communicationover the Internet or an intranet to permit interaction with a pluralityof remote computers and to provide requested services via applicationsrunning on the remote computers or on the servers. Accordingly, the datacenter cooling system 100 may include or be electrically coupled to oneor more power sources for powering the servers and related componentsand include a communication interface which may be configured for wiredand wireless transmissions to and from the data center. The power sourcemay be connected to a power grid or may be generated by batteries or anon-site generator.

The upper modules 118 and the lower modules 130, as well as the racks112, may be positioned in a human-occupiable workspace 102 of a datacenter building structure defined by a floor 104, a ceiling 106, and oneor more support members 108 (e.g., columns or beams). For example,although in the implementation of system 100, the support members 108are illustrated as columns (e.g., support members that extend betweenthe floor 104 and the ceiling 106), in some alternative implementations,the support members 108 may include one or more beams (e.g., supportmembers that extend parallel or substantially parallel to one or both ofthe floor 104 and the ceiling 106).

The floor 104 is suitable to support the racks 112, as well as otherdata center equipment not shown in this example (e.g., moving apparatuslike forklifts, hand-trucks, as well as furniture, power equipment, andother components). In some example implementations, the floor 104 may bea finished floor, such as a concrete or cement floor, with or withoutadditional covering (e.g., tile, laminate, or other covering). Inalternative example implementations, the floor 104 may represent araised floor (e.g., with individual floor tiles supported by posts orother structure) that is supported by a finished floor.

The ceiling 106, as shown, may be a finished ceiling of the data centerbuilding, such as a concrete or cement ceiling. In some aspects, theceiling 106 may be an underside of a floor 104 that is above thehuman-occupiable workspace, such as in the case of a data centerbuilding with multiple levels. In alternative aspects, the ceiling 106may represent a drop ceiling, with multiple, independent ceiling tilessupported in a grid structure.

As illustrated, the system 100 includes one or more rail assemblies 110that are attached to the support members 108. For example, as shown inFIGS. 1B-1C, the rail assemblies 110 may extend between, and be attachedto, adjacent support members 108 (e.g., columns) in the data centerbuilding structure. Alternatively, the rail assemblies 110 may extendbetween and across more than two support members 108, or may be attachedto other structure of the data center building, such as, for example,the ceiling 106. In some implementations, the rail assemblies 110 may bepart of the data center building structure, e.g., as weight-bearingstructure of the building. For example, the rail assemblies 110 may beI-beams, C-channels, or other structural members that, e.g., prevent orhelp prevent buckling or movement of the support members 108. Inalternative examples, the rail assemblies 110 may not be bear any weightof the data center building structure.

As illustrated, the one or more upper modules 118 are mounted on therail assemblies 110 via one or more roller assemblies 120. In someaspects, each roller assembly 120 may be attached to a frame or housingof the upper module 118 and include one or more wheels, rollers,casters, or other reduced-friction surface that contactingly engages therail assembly 110. The roller assemblies 120 facilitate movement of theupper modules 118 (and other components of the system 100) through thehuman-occupiable workspace 102 on the rail assemblies 110. As shown inFIG. 1B, there may be two roller assemblies 120 attached to the framesof each upper module 118, on sides of the frames adjacent to the railassemblies 110. In alternative aspects, there may be more than tworoller assemblies 120 attached to each upper module 118 to facilitatemovement of the upper module 119 through the data center.

As illustrated, each upper module 118 include an air conditioning module122 positioned within a frame of the upper module 118. The airconditioning module 122, in this example, includes an air-to-liquid heatexchanger 124, such as a cooling coil (e.g., water coil, glycol coil, DXcoil, or other form of cooling coil) or heating coil (e.g., liquid orelectric). The air conditioning module 122 may also include otherconditioning devices, such as humidifiers, dehumidifiers, energyrecovery ventilators, filters, and otherwise.

In this example, a cooling coil 124 is an A-frame cooling coil, althoughflat or other cooling coil forms are also suitable. In alternativeaspects, the heat exchanger 124 may be a thermoelectric heat exchanger,such as, for example, a Peltier cooler. In any event, the heat exchanger124 may be operated to receive a heated airflow from the racks 112 andcool the heated airflow to produce a cooling airflow to circulate to theracks 112. In some aspects, each air conditioning module 122 includesmultiple cooling coils 124, e.g., to provide redundancy or prevent alack of cooling if one of the cooling coils 124 is unusable. Inalternative aspects, there may be one cooling coil 124 per airconditioning module 122.

The illustrated air conditioning module 122 also includes one or morefans 126. In the illustrated example, the fans 126 are positioned on abottom side of the upper modules 118 and may also extend adjacent to orthrough apertures 135 on the bottom side of the upper modules 118. Theillustrated fans 126 may be centrifugal or axial flow fans andcontrollable to circulate a cooling airflow (and a heated airflow)through the human-occupiable workspace 102. In some aspects, each airconditioning module 122 includes multiple fans 126, e.g., to provideredundancy or prevent a lack of cooling if one of the fans 126 isunusable.

Although the illustrated implementation of the air conditioning module122 includes a cooling coil 124 and a fan 126, alternativeimplementations of the air conditioning module 122 may includeadditional or alternative components. For example, the air conditioningmodule 122 may include heaters (e.g., heating coils, electric heat,furnaces), humidifiers or evaporative cooling devices, boilers,dehumidifiers, energy recovery devices, variable air volume (VAV) boxes,air flow control and regulating stations, and other components.

The data center cooling system 100 also includes one or more lowermodules 130. As shown in FIGS. 1A-1B, the lower modules 130 are mountedto the bottom sides of respective upper modules 118. In some examples,there may be a 1:1 ratio of lower modules 130 to upper modules 118. Inother examples, there may be more-lower modules 130 than upper modules118 (e.g., more than one lower module 130 is mounted to each uppermodule 118). In other examples, there may be fewer lower modules 130than upper modules 118 (e.g., one lower module 130 is mounted to morethan one upper module 118). The lower modules 130 may be permanently orsemi-permanently mounted to the upper modules 118. For example, thelower modules 130 may be fastened, such as with screws, bolts, rivets,adhesive, or other fastening mechanisms, to the upper modules 118.Alternatively, the lower modules 130 may be welded or brazed to theupper modules 118.

Each lower module 130 includes sides that extend vertically downwardfrom the upper module 118 to meet a top end of two rows of racks 112.For example, as shown in FIG. 1A, the lower module 130 includes a topside (e.g., with the aperture 134 there through) attached or adjacent tothe bottom side of the upper module 118 and sides that extend to meetthe tops of two rows of racks 112 with seals 138. The seals 138 (e.g.,sheet metal, flexible vinyl, or other sealing material) couple bottomedges of the sides of the lower module 130 to top edges of the rows ofracks 112. The seals 138 may prevent or substantially prevent (e.g.,with little air leakage) air that is circulated from the upper module118 to a cool air plenum 142 to escape into a warm air plenum of thehuman-occupiable workspace 102 of the data center building withoutpassing through the racks 112.

As further illustrated, the lower modules 130 include one or more cabletrays 136. The cable trays 136, for example, may support power cablingfor the heat-generating devices 148, the fans 126, or otherelectricity-using components of the system 100. In addition oralternatively, other power supply support equipment, such as bus ducts,cord reels, lighting, and other equipment may be mounted to the lowermodules 130 (e.g., in the cable trays 136 or to the sides of the module130). As additional examples, the lower modules 130 may support controlwiring, as well as fiber cabling and a fiber conveyance system.

In the illustrated implementation of the data center cooling system 100,an accessory module 128 is positioned between, and in some aspects,attached to, upper modules 118 that are side-by-side. In the illustratedimplementation, the accessory module 128 includes or comprises a pipingbridge that may support one or more pipes or other conduits. Forexample, as shown, a supply cooling liquid conduit 148 may be supportedby the accessory module 128 and fluidly connect the cooling coils 124(of the adjacent upper modules 118 or other upper modules) to a sourceof a cooling liquid (e.g., a chiller plant, evaporative cooling system,body of water, a combination thereof, or other source of coolingliquid). A return cooling liquid conduit 150 may also be supported bythe accessory module 128 and fluidly connect the cooling coils 124 (ofthe adjacent upper modules 118 or other upper modules) to the source ofcooling liquid.

In additional implementations, the accessory module 128 may supportadditional structure or data center operational equipment. For example,in some aspects, the accessory module 128 may include or be attachedwith a drop-down ceiling structure on a bottom side of the module 128that helps thermally separate the warm air plenum 146 and the cold airplenum 142. In addition, the accessory module 128 may support or containfire protection system equipment, such as piping, electrical conduit(e.g., a bus duct), sprinkler heads, and other equipment that is used ina fire protection system for the data center. As another example, theaccessory module 128 may support or contain lighting equipment, such aselectrical conduit and raceways or bus ducts, lights, and otherequipment that is used in a lighting system for the data center.

In an example operation of the air conditioning module 122, a heatedairflow 144 may pass into a warm air plenum 146 of the human-occupiableworkspace 102 after passing through the racks 112. The heated airflow144 is circulated (e.g., by the fans 126) through the warm air plenum146 which extends upward toward the upper modules 118. The heatedairflow 146 passes through the cooling coils 124, where it is cooled toremove heat generated by the electronic devices 148 (e.g., and otherheat-generating objects in the human-occupiable workspace 102, such asworkers or auxiliary equipment). A cooling airflow 140 is circulated(e.g., by the fans 126) from the cooling coils 124 into a cold airplenum 142 that is defined within the lower module 130 and between rowsof racks 112, as shown. The cooling airflow 140 enters the back sides116 of the racks 112, which are open (e.g., without cabinet or otherstructure to substantially impede airflow there through) to both thecold air plenum 142 and warm air plenum 146. As the cooling airflow 142passes between back sides 116 of the racks 112 and front sides 114 ofthe racks 112, heat from the electronic devices 148 is convectivelytransferred into the airflow so that the heated airflow 144 exits thefront sides 114.

As shown in FIGS. 1A-1C, both sets of modules (e.g., the upper modules118 and lower modules 130), as well as the accessory module 128, aresuspended above the floor 104. Thus, any sagging of the floor 104, or afloor above the floor 104 (e.g., in the case of a multi-story datacenter) due to, for instance, changes in loading on the floor(s) doesnot affect the modules' elevation (e.g., vertical position). Forexample, the upper modules 118 are supported by the rails 110, which inturn are supported by the building columns 108, and not, e.g., girders(upper floor support steel). This may be advantageous in that theinterface between a lower module 130 and the racks 112 is not affectedby upper floor loading.

FIG. 2 is an isometric view of a schematic illustration of a data centersystem 200 comprised of multiple scalable data center cooling systems.As shown in this figure, lower data center cooling modules 205 areshown, side-by-side. Each lower data center cooling module 205, forexample, may be comprised of multiple lower modules 130 that are joinedend-to-end as an integrated module 205. Each lower data center coolingmodule 205 is comprised of a top panel 210 that includes one or moreapertures 220, and side panels 225 that extend downward from the toppanel 210 on each of two lengthwise edges of the top panel 210. Mountedwithin a volume defined by the side panels 225 and top panel 210 arecable trays 215 that can support power and information equipment, suchas power cabling, network cabling, cable reels, uninterruptible powersupplies (UPS), and other equipment.

As shown in FIG. 2, the data center system 200 includes multiple upperdata center cooling modules 230. Each upper data center cooling module230 is attachable (e.g., permanently or semi-permanently) to the lowerdata center cooling module 205. Each upper data center cooling module230, in this example, includes two upper modules 230 joined together byan accessory module 240 there between. Each upper module 230 includes aframe that supports a cooling coil 255. In some aspects, when the upperdata center cooling modules 230 are attached to the lower data centercooling module 205, the cooling coils 255 are positioned verticallyabove the apertures 220. The cooling coils 255 may be fluidly connectedto a cooling fluid supply conduit 250 and a cooling fluid return conduit245 that are supported by the accessory module 240.

As illustrated in FIG. 2, roller assemblies 260 are mounted at cornersof the upper modules 235. The roller assemblies 260 may facilitatemovement of the upper data center cooling modules 230 along a railsystem (e.g., I-beam, C-channel, or other structural members) that arepart of or attached to a data center building structure.

FIGS. 3A-3C are flowcharts depicting example methods 300, 320, and 350,respectively, of arranging a scalable data center cooling system andcooling a data center. FIG. 3A illustrates method 300, which may beperformed with the data center cooling system 100, the data centersystem 200, or other data center cooling system according to the presentdisclosure. Method 300 may begin at step 302, which includes installinga first module of a data center cooling system on a rail assemblyattached to a data center building. For example, in some aspects, anupper module, which includes a cooling system, may be mounted on a railassembly (e.g., an I-beam, C-channel, or other structural member) thatis attached to structure of the data center building. The structure mayinclude, for example, columns that extend between a floor and a ceiling(or a roof) of the data center building. The structure may also include,for instance, beams (e.g., joists) that extend between columns of thedata center building or hung from a ceiling or roof of the building. Insome aspects, the upper module is mounted on the rail assembly with oneor more roller assemblies (e.g., wheels, casters, rollers) that areattached to the upper module.

Method 300 may continue at step 304, which includes attaching a secondmodule of the data center cooling system to the first module. Forexample, in some aspects, a lower module, which may include cable traysand other power and information support equipment, may be mounted to abottom portion of the upper module. The lower module may include sidesthat extend from a top panel of the lower module. The sides may extendvertically downward to suspend above the floor of the data center at aheight to receive rows of server (or other electronic) racks therebetween. In some aspects, step 304 may be performed prior to step 302,e.g., the lower module may be connected (e.g., fastened, welded) to theupper module prior to the upper module being mounted on the railassembly.

Method 300 may continue at step 306, which includes moving, on a railsystem, the first and second modules of the data center cooling systemadjacent to the rows of data center racks that support heat-generatingelectronic devices (e.g., servers, networking devices, or otherelectronic devices). For example, the rail system may include the railand roller assemblies, which cooperatively facilitate rolling (or otherfrictionless or near frictionless) movement of the data center coolingsystem that includes the upper and lower modules within ahuman-occupiable workspace of the data center building. Rows of the datacenter racks may be pre-deployed (e.g., installed prior to step 302) inthe data center building, at locations that allow for movement of thedata center cooling system adjacent the rows (e.g., as shown in FIGS.1A-1C).

Method 300 may continue at step 308, which includes fluidly coupling acooling module of the first module of the data center cooling system toa source of cooling fluid. In some aspects, each upper module mayinclude one or more cooling coils that use a cooling fluid to coolheated air in an air-to-liquid heat exchanger. Supply and returnconduits, which may be supported by an accessory module coupled to theupper module, may be fluidly connected to the coiling coils and to asource of the cooling fluid (e.g., chiller, cooling tower, heatexchanger, body of water, or other source of cooling fluid). In someaspects, supply and return conduit segments, mounted in a particularaccessory module prior to steps 302-306, may be fluidly coupled (e.g.,welded, with grooved piping, or other coupling technique) to othersegments previously deployed in the data center building on otheraccessory modules in previously deployed data center cooling systems.

Method 300 may continue at step 310, which includes electricallycoupling the heat-generating electronic devices to a source ofelectrical power through electrical support assemblies on the secondmodule. For example, in some aspects, the electronic devices may beelectrically coupled to power conduits (e.g., bus ducts or power busesor other power supply equipment) that are supported by the lower module.Such power conduits or bus ducts may be electrically coupled, or mayhave previously been electrically coupled, to a source of power at thedata center building (e.g., utility power grid, generator, batteries,solar power or wind power systems, or other power source). Othercomponents may also be electrically coupled to the source of electricalpower in step 310. For example, fans that are part of the coolingmodules in the upper modules may be electrically coupled to the sourceof power. Controllers, control equipment, motor controllers, variablefrequency drives, and other cooling system automation equipment (e.g.,sensors, actuators) may also be electrically coupled to the source ofelectrical power in step 310.

Method 300 may continue at step 312, which includes operating thecooling module to cool the heat-generating electronic devices duringoperation of the data center. For example, once the racks and datacenter cooling system are in position in the data center cooling system,the electronic devices may be operated to provide Information Technology(IT) services. During operation of the electronic devices, heat isgenerated which may be removed by a cooling airflow circulated by thecooling module.

FIG. 3B illustrates method 320, which may be performed with the datacenter cooling system 100, the data center system 200, or other datacenter cooling system according to the present disclosure. In someaspects, method 320 may include sub-steps to step 312 in method 300.Method 320 may begin at step 322, which includes circulating a coolingfluid through a supply conduit to a cooling coil of the cooling module.The cooling fluid may be, for example, chilled water, chilled glycol, aliquid refrigerant (e.g., in a direct expansion system), condenser wateror other evaporatively cooled liquid, liquid from a natural or man-madebody of water, or other cooling liquid. In some aspects, the coolingliquid is pumped from a source of the cooling liquid (e.g., a centralplant) through supply conduits that are mounted in accessory modules ofdata center cooling systems as described with reference to FIGS. 1A-1C.The supply conduits may be segmented when installed as part of theaccessory modules and joined (e.g., welded or connected) once the datacenter cooling systems are in place adjacent to rows of racks.Alternatively, the supply conduits may be installed in the accessorymodules subsequent to the data center cooling systems being moved intoplace adjacent to rows of racks.

Method 320 may continue at step 324, which includes circulating, with afan of the cooling module, a cooling airflow from the cooling coil to acold air plenum defined in the second module and between the rows of theracks. For example, as shown in FIGS. 1A-1C, fans that are mounted to abottom portion of the upper module (e.g., through apertures in a toppanel of the lower modules) may circulate a cooling airflow downwardfrom cooling coils through the lower modules (e.g., between side panelsof the lower modules). In some aspects, the side panels (and otherportions) of the lower modules may be insulated so that heat from awarm-air plenum external to the lower modules (e.g., within thehuman-occupiable workspace) does not transfer (or is impeded fromtransferring) into the cooling airflow within the lower module. The coldair plenum extends between rows of racks, into which the cooling airflowcirculates by fan operation.

Method 320 may continue at step 326, which includes circulating thecooling airflow from the cold air plenum through the rows of racks toremove heat from the heat-generating electronic devices. The coolingairflow, driven by the fans of the cooling modules in the upper modules,circulates through rows of racks (as shown in FIGS. 1A-1C). As thecooling airflow circulates through the racks, heat from heat-generatingelectronic devices (e.g., servers, networking equipment, or otherdevices) is convectively transferred to the cooling airflow, warming theairflow. Thus, cooling airflow at a temperature below an operatingtemperature of the devices enters, in this example, a back open side ofthe rows of racks, and a heated airflow (at or slightly below theoperating temperature) leaves a front open side of the rows of racks. Insome aspects, additional fans may be mounted on or near the servers tofurther circulate the heated airflow from the racks.

Method 320 may continue at step 328, which includes circulating heatedairflow from the rows of racks into a warm air plenum defined by ahuman-occupiable area of the data center. Once the heated airflow leavesthe rows of racks, for example, the airflow circulates (e.g., by thefans) into the area adjacent the front open sides of the rows of racks.The warm air plenum extends through the human-occupiable area and upwardto the ceiling of the data center building structure.

Method 320 may continue at step 330, which includes circulating theheated airflow from the warm air plenum to the cooling module. Forexample, as the heated airflow is circulated by the fans through thewarm air plenum, the fans pull (in this example) the heated airflowtoward and through the cooling coils of the cooling modules. Thus,heated airflow is cooled in the cooling coils by transferring heat fromthe airflow to the cooling liquid that is circulated through the coolingcoils. The cooling liquid, heated by the heated airflow, is recirculatedback to the source of the cooling liquid (e.g., through return conduits)to be re-cooled. Of course, steps 322-330 may be performed many timesover and over as the data center operates.

FIG. 3C illustrates method 350, which may be performed with the datacenter cooling system 100, the data center system 200, or other datacenter cooling system according to the present disclosure. Method 350may begin at step 352, which includes a determination of whether anadjustment to deployment of heat-generating electronic devices in datacenter has occurred. An adjustment to deployment may include one or moreof the following actions. For example, in some aspects, an adjustmentmay include adding additional heat-generating devices (e.g., servers) toone or more racks that are already being cooled by previously deployeddata center cooling systems as described with reference to FIGS. 1A-1C.As another example, an adjustment may include adding additional racks toone or more rows that are already being cooled by previously deployeddata center cooling systems as described with reference to FIGS. 1A-1C.As another example, an adjustment may include adding additional rows ofracks to a data center that includes one or more rows that are alreadybeing cooled by previously deployed data center cooling systems asdescribed with reference to FIGS. 1A-1C. As another example, anadjustment may include replacing existing heat-generating devices (e.g.,servers) with higher power density devices that generate more heatduring operation to one or more racks that are already being cooled bypreviously deployed data center cooling systems as described withreference to FIGS. 1A-1C. As yet another example, an adjustment mayinclude operating existing heat-generating devices (e.g., servers) at agreater utilization or power state, thereby generating more heat thanpreviously, in one or more rows that are already being cooled bypreviously deployed data center cooling systems as described withreference to FIGS. 1A-1C. Generally, however, an adjustment todeployment may include any action which adjusts (increases or decreases)an amount of heat being generated by heat-generating electronic devicesin a data center during operation of the data center. If thedetermination in step 352 is “no” then method 350 may continue at step312, and operation of the data center cooling modules may continue.

If the determination in step 352 is “yes” then method 350 may continueat step 354, which includes installing a first module of another datacenter cooling system on the rail assembly. For example, in someaspects, another upper module, which includes another cooling system ormodule (e.g., cooling coil(s) and fan(s), may be mounted on a railassembly (e.g., the I-beam, C-channel, or other structural member) thatis attached to structure of the data center building. The structure mayinclude, for example, columns that extend between a floor and a ceiling(or a roof) of the data center building. The structure may also include,for instance, beams (e.g., joists) that extend between columns of thedata center building or hung from a ceiling or roof of the building. Insome aspects, the other upper module is mounted on the rail assemblywith one or more roller assemblies (e.g., wheels, casters, rollers) thatare attached to the upper module.

Method 350 may continue at step 356, which includes attaching a secondmodule of the other data center cooling system to the first module. Forexample, in some aspects, another lower module, which may include cabletrays and other power and information support equipment, may be mountedto a bottom portion of the additional upper module. The additional lowermodule may include sides that extend from a top panel verticallydownward to suspend above the floor of the data center at a height toreceive rows of server (or other electronic) racks there between. Insome aspects, step 356 may be performed prior to step 354, e.g., theadditional lower module may be connected (e.g., fastened, welded) to theadditional upper module prior to the upper module being mounted on therail assembly.

Method 350 may continue at step 358, which includes moving, on the railsystem, the first and second modules of the other data center coolingsystem adjacent to the rows of data center racks that supportheat-generating electronic devices. For example, the rail system mayinclude the rail and roller assemblies, which cooperatively facilitaterolling (or other frictionless or near frictionless) movement of theadditional data center cooling system that includes the additional upperand lower modules within the human-occupiable workspace of the datacenter building.

Method 350 may continue at step 360, which includes fluidly coupling acooling module of the first module of the other data center coolingsystem to the source of cooling fluid. In some aspects, each uppermodule may include one or more cooling coils that use a cooling fluid tocool heated air in an air-to-liquid heat exchanger. Supply and returnconduits, which may be supported by an accessory module coupled to theupper module, may be fluidly connected to the coiling coils and to asource of the cooling fluid (e.g., chiller, cooling tower, heatexchanger, body of water, or other source of cooling fluid). In someaspects, supply and return conduit segments, mounted in a particularaccessory module prior to steps 302-306, may be fluidly coupled (e.g.,welded, with grooved piping, or other coupling technique) to othersegments previously deployed in the data center building on otheraccessory modules in previously deployed data center cooling systems.

Method 350 may continue at step 362, which includes electricallycoupling the heat-generating electronic devices to the source ofelectrical power through electrical support assemblies on the secondmodule of the other data center cooling system. For example, in someaspects, the electronic devices may be electrically coupled to powerconduits (e.g., bus ducts or power buses or other power supplyequipment) that are supported by the lower module. Such power conduitsor bus ducts may be electrically coupled, or may have previously beenelectrically coupled, to a source of power at the data center building(e.g., utility power grid, generator, batteries, solar power or windpower systems, or other power source). Other components may also beelectrically coupled to the source of electrical power in step 310. Forexample, fans that are part of the cooling modules in the upper modulesmay be electrically coupled to the source of power. Controllers, controlequipment, motor controllers, variable frequency drives, and othercooling system automation equipment (e.g., sensors, actuators) may alsobe electrically coupled to the source of electrical power in step 310.

Method 350 may continue at step 364, which includes operating thecooling module of the other data center cooling system to cool theheat-generating electronic devices during operation of the data center.For example, once the racks and data center cooling system are inposition in the data center cooling system, the electronic devices maybe operated to provide Information Technology (IT) services. Duringoperation of the electronic devices, heat is generated which may beremoved by a cooling airflow circulated by the cooling module.

Method 350 may also include one or more steps (or not include one ormore steps) shown in FIG. 3C. For example, in some aspects, anadjustment to deployment may not require an additional data centercooling system to be moved into the data center. Instead, an adjustmentto deployment may require a change to an operating condition to anexisting data center cooling system adjacently placed by rows of racks.For example, an adjustment to an airflow volume being circulated by thefans of the data center cooling systems, an adjustment to a coolingliquid flow rate circulated to cooling coils of the data center coolingsystems, or an adjustment to one or more temperature or pressure setpoints (e.g., of the cooling airflow or cooling liquid flow) may addressthe adjustment to deployment. Also, in some cases, an adjustment todeployment may then lead to a reduction of a number of data centercooling systems in the data center (e.g., a removal of rows of racks).In which case, the data center cooling systems may be removed in aprocess that is substantially opposite of method 350 (e.g., electricityand cooling liquid are decoupled from the data center cooling systems,and the data center cooling systems are moved away or out of the datacenter on the rail assemblies).

FIG. 4 is a schematic illustration of an example controller 400 (orcontrol system) for an on-board fuel separation system. For example, thecontroller 400 can be used for the operations described previously, forexample as or as part of a control system that performs one or moresteps of methods 300, 320, and 350 described in FIGS. 3A-3C. Forexample, the controller 400 may be communicably coupled with, or as apart of, a data center cooling system that includes, e.g., pumps, fans,modulating valves, and other controllable components.

The controller 400 is intended to include various forms of digitalcomputers, such as printed circuit boards (PCB), processors, digitalcircuitry, or otherwise that is part of a vehicle. Additionally thesystem can include portable storage media, such as, Universal Serial Bus(USB) flash drives. For example, the USB flash drives may storeoperating systems and other applications. The USB flash drives caninclude input/output components, such as a wireless transmitter or USBconnector that may be inserted into a USB port of another computingdevice.

The controller 400 includes a processor 410, a memory 420, a storagedevice 430, and an input/output device 440. Each of the components 410,420, 430, and 440 are interconnected using a system bus 450. Theprocessor 410 is capable of processing instructions for execution withinthe controller 400. The processor may be designed using any of a numberof architectures. For example, the processor 410 may be a CISC (ComplexInstruction Set Computers) processor, a RISC (Reduced Instruction SetComputer) processor, or a MISC (Minimal Instruction Set Computer)processor.

In one implementation, the processor 410 is a single-threaded processor.In another implementation, the processor 410 is a multi-threadedprocessor. The processor 410 is capable of processing instructionsstored in the memory 420 or on the storage device 430 to displaygraphical information for a user interface on the input/output device440.

The memory 420 stores information within the controller 400. In oneimplementation, the memory 420 is a computer-readable medium. In oneimplementation, the memory 420 is a volatile memory unit. In anotherimplementation, the memory 420 is a non-volatile memory unit.

The storage device 430 is capable of providing mass storage for thecontroller 400. In one implementation, the storage device 430 is acomputer-readable medium. In various different implementations, thestorage device 430 may be a floppy disk device, a hard disk device, anoptical disk device, or a tape device.

The input/output device 440 provides input/output operations for thecontroller 400. In one implementation, the input/output device 440includes a keyboard and/or pointing device. In another implementation,the input/output device 440 includes a display unit for displayinggraphical user interfaces.

The features described can be implemented in digital electroniccircuitry, or in computer hardware, firmware, software, or incombinations of them. The apparatus can be implemented in a computerprogram product tangibly embodied in an information carrier, forexample, in a machine-readable storage device for execution by aprogrammable processor; and method steps can be performed by aprogrammable processor executing a program of instructions to performfunctions of the described implementations by operating on input dataand generating output. The described features can be implementedadvantageously in one or more computer programs that are executable on aprogrammable system including at least one programmable processorcoupled to receive data and instructions from, and to transmit data andinstructions to, a data storage system, at least one input device, andat least one output device. A computer program is a set of instructionsthat can be used, directly or indirectly, in a computer to perform acertain activity or bring about a certain result. A computer program canbe written in any form of programming language, including compiled orinterpreted languages, and it can be deployed in any form, including asa stand-alone program or as a module, component, subroutine, or otherunit suitable for use in a computing environment.

Suitable processors for the execution of a program of instructionsinclude, by way of example, both general and special purposemicroprocessors, and the sole processor or one of multiple processors ofany kind of computer. Generally, a processor will receive instructionsand data from a read-only memory or a random access memory or both. Theessential elements of a computer are a processor for executinginstructions and one or more memories for storing instructions and data.Generally, a computer will also include, or be operatively coupled tocommunicate with, one or more mass storage devices for storing datafiles; such devices include magnetic disks, such as internal hard disksand removable disks; magneto-optical disks; and optical disks. Storagedevices suitable for tangibly embodying computer program instructionsand data include all forms of non-volatile memory, including by way ofexample semiconductor memory devices, such as EPROM, EEPROM, and flashmemory devices; magnetic disks such as internal hard disks and removabledisks; magneto-optical disks; and CD-ROM and DVD-ROM disks. Theprocessor and the memory can be supplemented by, or incorporated in,ASICs (application-specific integrated circuits).

To provide for interaction with a user, the features can be implementedon a computer having a display device such as a CRT (cathode ray tube)or LCD (liquid crystal display) monitor for displaying information tothe user and a keyboard and a pointing device such as a mouse or atrackball by which the user can provide input to the computer.Additionally, such activities can be implemented via touchscreenflat-panel displays and other appropriate mechanisms.

The features can be implemented in a control system that includes aback-end component, such as a data server, or that includes a middlewarecomponent, such as an application server or an Internet server, or thatincludes a front-end component, such as a client computer having agraphical user interface or an Internet browser, or any combination ofthem. The components of the system can be connected by any form ormedium of digital data communication such as a communication network.Examples of communication networks include a local area network (“LAN”),a wide area network (“WAN”), peer-to-peer networks (having ad-hoc orstatic members), grid computing infrastructures, and the Internet.

While this specification contains many specific implementation details,these should not be construed as limitations on the scope of anyinventions or of what may be claimed, but rather as descriptions offeatures specific to particular implementations of particularinventions. Certain features that are described in this specification inthe context of separate implementations can also be implemented incombination in a single implementation. Conversely, various featuresthat are described in the context of a single implementation can also beimplemented in multiple implementations separately or in any suitablesubcombination. Moreover, although features may be described above asacting in certain combinations and even initially claimed as such, oneor more features from a claimed combination can in some cases be excisedfrom the combination, and the claimed combination may be directed to asubcombination or variation of a subcombination.

Similarly, while operations are depicted in the drawings in a particularorder, this should not be understood as requiring that such operationsbe performed in the particular order shown or in sequential order, orthat all illustrated operations be performed, to achieve desirableresults. In certain circumstances, multitasking and parallel processingmay be advantageous. Moreover, the separation of various systemcomponents in the implementations described above should not beunderstood as requiring such separation in all implementations, and itshould be understood that the described program components and systemscan generally be integrated together in a single software product orpackaged into multiple software products.

A number of implementations have been described. Nevertheless, it willbe understood that various modifications may be made without departingfrom the spirit and scope of the disclosure. For example, exampleoperations, methods, or processes described herein may include moresteps or fewer steps than those described. Further, the steps in suchexample operations, methods, or processes may be performed in differentsuccessions than that described or illustrated in the figures.Accordingly, other implementations are within the scope of the followingclaims.

1. A method of conditioning a data center comprising: installing a firstmodule of a data center cooling system on a rail assembly attached to adata center building, the first module comprising a frame and an airconditioning module; attaching a second module of the data centercooling system to the first module, the second module comprising a panelattached to the frame of the first module and sides that verticallyextend from the panel to suspend over a floor of the data centerbuilding and define a cold air plenum between rows of a plurality ofdata center racks; and moving the first and second modules of the datacenter cooling system adjacent to the rows of the plurality of datacenter racks that support a plurality of heat-generating electronicserver devices by moving the first module on the rail system through ahuman-occupiable aisle of a workspace of the data center buildingdefined between rows of columns of the data center building.
 2. Themethod of claim 1, further comprising circulating a cooling fluidthrough a supply conduit, to the air conditioning module, that issupported by a third module of the data center cooling system attachedto the first module.
 3. The method of claim 1, further comprisingcirculating, with a fan of the air conditioning module, an airflow froma cooling coil of the air conditioning module through an opening in thepanel and into the cold air plenum defined by the panel and the sides ofthe second module.
 4. The method of claim 3, further comprising:circulating the airflow through the plurality of data center racks;receiving, into the airflow, heat from the plurality of heat-generatingelectronic server devices; and circulating the heated airflow throughthe workspace of the data center building and to the cooling coil. 5.The method of claim 1, wherein the data center cooling system comprisesa first data center cooling system, the method further comprising:installing at least another row of a plurality of data center racks thatsupport a plurality of heat-generating electronic server devices intothe data center building; based on the installation of the at leastanother row of the plurality of data center racks, installing a firstmodule of a second data center cooling system on the rail assemblyattached to the data center building, the first module of the seconddata center cooling system comprising a frame and an air conditioningmodule; attaching a second module of the second data center coolingsystem to the first module of the second data center cooling system, thesecond module of the second data center cooling system comprising apanel attached to the frame of the first module of the second datacenter cooling system and sides that extend from the panel to suspendover the floor of the data center building; and moving the first andsecond modules of the second data center cooling system adjacent to theanother row of the plurality of data center racks by moving the firstmodule of the second data center cooling system on the rail systemthrough the human-occupiable aisle of the workspace of the data centerbuilding defined between rows of columns of the data center building. 6.The method claim 5, further comprising fluidly connecting the airconditioning modules of the first modules of the first and second datacenter cooling systems to a source of cooling fluid.
 7. The method ofclaim 1, further comprising electrically coupling the plurality ofheat-generating electronic server devices to a main power supply throughelectrical conduits supported on the second module.
 8. The method ofclaim 1, wherein the data center cooling system comprises a first datacenter cooling system, the method further comprising: adjusting a powerdensity of at least a portion of the plurality of heat-generatingelectronic server devices; based on the adjustment of the power density:installing a first module of a second data center cooling system on therail assembly attached to the data center building, the first module ofthe second data center cooling system comprising a frame and an coolingair conditioning module; attaching a second module of the second datacenter cooling system to the first module of the second data centercooling system, the second module of the second data center coolingsystem comprising a panel attached to the frame of the first module ofthe second data center cooling system and sides that extend from thepanel to suspend over the floor of the data center building; and movingthe first and second modules of the second data center cooling systemadjacent to the row of the plurality of data center racks by moving thefirst module of the second data center cooling system on the rail systemthrough the human-occupiable aisle of the workspace of the data centerbuilding defined between rows of columns of the data center building;and operating the first and second data center cooling systems to coolthe plurality of heat-generating electronic server devices.
 9. Themethod of claim 6, further comprising electrically coupling theplurality of heat-generating electronic server devices to a main powersupply through electrical conduits supported on the second module. 10.The method of claim 1, further comprising fluidly connecting the airconditioning module of the first module of the data center coolingsystems to a source of cooling fluid.
 11. The method of claim 10,wherein the source of cooling fluid comprises at least one of a chillerplant, an evaporative cooling system, a body of water.
 12. The method ofclaim 11, wherein the cooling fluid comprises at least one of chilledwater, chilled glycol, or condenser water.
 13. The method of claim 1,further comprising illuminating at least a portion of the data centerbuilding with a lighting system.
 14. The method of claim 13, furthercomprising supporting lighting equipment of the lighting system with anaccessory module that is coupled to the first module.
 15. The method ofclaim 14, further comprising supporting a plurality of cooling fluidconduits on the accessory module.
 16. The method of claim 14, furthercomprising positioning the accessory module in the data center buildingabove the first module.
 17. The method of claim 8, further comprisingilluminating at least a portion of the data center building with alighting system.
 18. The method of claim 17, further comprisingsupporting lighting equipment of the lighting system with an accessorymodule that is coupled to the first module of either of the first orsecond data center cooling systems.
 19. The method of claim 18, furthercomprising supporting a plurality of cooling fluid conduits on theaccessory module.
 20. The method of claim 18, further comprisingpositioning the accessory module in the data center building above thefirst module of either of the first or second data center coolingsystems.